3s Silicon Tech., Inc.

3s Silicon Tech., Inc. is a specialized manufacturer in the semiconductor equipment industry, focusing primarily on the development and production of high-power discrete component packaging equipment. Established in 1998 and headquartered in Hsinchu, Taiwan, the company serves as a niche market leader in providing die bonders—critical machines used in the assembly and packaging of discrete power devices such as diodes, Power MOSFETs, and high-power LEDs. Its core product portfolio includes die bonders, clip attach devices, reflow ovens (including advanced formic acid reflow ovens), stencil printers, glue dispensers, and customized production automation solutions. These products are vital in enabling precise, reliable, and scalable back-end semiconductor packaging processes, which are essential for the efficient manufacturing of power electronic components. 3s Silicon Tech., Inc. supplies its equipment to both domestic and global markets, supporting sectors such as consumer electronics, automotive electronics, and LED lighting, thereby contributing to the broader advancement of energy-efficient and high-performance electronic systems.