Winstek Semiconductor Co., Ltd.

Winstek Semiconductor Co., Ltd. is a leading Taiwanese provider of semiconductor testing and wafer bumping services. Established in 2000 and headquartered in Hsinchu City, the company delivers comprehensive solutions for integrated circuit (IC) manufacturers, including wafer sort, final and post-test services, as well as advanced bumping technologies such as copper pillar bumps, wafer-level chip-scale packaging, and lead-free bumps. Winstek also offers a suite of backend services like die processing, wafer thinning, singulation, and flip chip assembly, alongside integrated reliability and failure analysis laboratories. The company is recognized for its strong relationships with major foundries, enabling it to offer end-to-end test and assembly services across sectors such as communications, computing, and consumer electronics. As a critical subcontractor in the semiconductor supply chain, Winstek continually pioneers developments in packaging and testing technologies, including silicon photonics, supporting innovation and efficiency in the global semiconductor industry.