Disco Corporation

Disco Corporation is a leading manufacturer engaging in the development and production of precision machines and equipment, particularly for the semiconductor, electronic component, and optical industries. Known for its dicing and grinding equipment, Disco plays a crucial role in the semiconductor production process, helping in cutting silicon wafers into individual dies, which are essential for the functioning of electronic devices. The company's technology and machinery ensure high precision and efficiency, which are vital for the high-quality standards required in the production of microelectronics. Serving a global client base, Disco's machines are integral to industries ranging from consumer electronics to automotive and telecommunications. With its focus on innovative solutions, Disco not only manufactures the equipment but also provides supplementary services such as training programs and maintenance, ensuring optimal machine operation. Its contributions are significant in supporting the continual miniaturization and advancement of electronic components, reflecting its pivotal position within the industrial supply chain and the broader technological landscape.

CEO

Mr. Kazuma Sekiya

Employees

5,256

Website

disco.co.jp