Xintec Inc.

Xintec Inc. is a Taiwan-based semiconductor company specializing in advanced packaging solutions, primarily focusing on wafer level chip scale packaging and related services. Established in 1998, the company pioneered wafer level chip scale packaging (WLCSP) commercialization in Taiwan and offers a comprehensive suite of packaging technologies, including wafer level post passivation interconnection, optical sensor chip scale packaging, and wafer testing services. These solutions are integral for sectors such as consumer electronics, computers, communications, automotive, medical, and industrial applications, providing enhanced miniaturization, performance, and cost efficiency for integrated circuits. Xintec's expertise encompasses packaging services for image, fingerprint, actuator, and environmental sensors, as well as micro-electromechanical systems (MEMS), power and analog components. Renowned for its technical innovation and flexible manufacturing, Xintec serves clients across Asia, the United States, and Europe, supporting global supply chains in high-growth technology markets.